Shepherd and Wedderburn sponsors UKSPA’s Edinburgh conference

4 October 2016


Shepherd and Wedderburn sponsors UKSPA’s Edinburgh conference

Coinciding with the 20th birthday of Dolly the Sheep, leading figures in the science, technology and innovation sector will gather at the United Kingdom Science Park Association’s (UKSPA) Edinburgh conference.

The main focus of the two-day event is on innovation, investment, inclusivity and internationalisation, with a programme that spans topics such as: connecting research to business; entrepreneurship and international connectivity;  innovation; and knowledge infrastructures.

Leading UK law firm, Shepherd and Wedderburn is sponsoring the conference and its specialist Pharma and Life Sciences group will be represented at the event. 

The panel of eminent participants include Joanna Boag-Thomson, partner and Head of Pharma and Life Sciences at the firm.  Joanna has vast experience in intellectual property matters, regularly advising on issues affecting the life sciences community — from formation, product testing, development and clinical trials, to contract manufacturing, marketing and commercial agreements. Supremely well qualified in this field, she will chair a workshop and lead the discussion on ‘Europe and beyond – International Trade and the Knowledge Economy’. 

The session aims to give a post-Brexit update on the Transatlantic Trade and Investment Partnership and provides an opportunity to take stock of current initiatives and their impact on the financial wellbeing of innovative companies. 

The UKSPA Edinburgh conference takes place on 6-7 October at the Pentlands Science Park and the Roslin Institute. Further information can be found here.

About UKSPA

The mission of UKSPA is to be the authoritative body on the planning, development and the creation of Science Parks and other innovation locations that are facilitating the development and management of innovative, high growth, knowledge-based organisations. Further information can be found on the UKSPA website.